Umkhiqizi we-PCB Wokuncintisana

ukucwiliswa ohlangothini olulodwa igolide Ceramic based Board

Incazelo emfushane:

Uhlobo lwezinto ezibonakalayo: isisekelo se-ceramic

Isibalo sesendlalelo: 1

Ubuncane bobubanzi bokulandelela/isikhala: 6 mil

Usayizi wembobo encane: 1.6mm

Ugqinsi lwebhodi eliqediwe: 1.00mm

Ugqinsi lwethusi oluqediwe: 35um

Qeda: ENIG

Umbala wemaski we-Solder: blue

Isikhathi sokuhola: izinsuku eziyi-13


Imininingwane Yomkhiqizo

Omaka bomkhiqizo

Uhlobo lwezinto ezibonakalayo: isisekelo se-ceramic

Isibalo sesendlalelo: 1

Ubuncane bobubanzi bokulandelela/isikhala: 6 mil

Usayizi wembobo encane: 1.6mm

Ugqinsi lwebhodi eliqediwe: 1.00mm

Ugqinsi lwethusi oluqediwe: 35um

Qeda: ENIG

Umbala wemaski we-Solder: blue

Isikhathi sokuhola: izinsuku eziyi-13

ibhodi le-ceramic esekelwe

I-Ceramic substrate isho ucwecwe lwethusi ezingeni lokushisa eliphezulu elihlanganiswe ngokuqondile ne-aluminium oxide (Al2O3) noma i-aluminium nitride (AlN) ye-ceramic substrate surface (ipuleti lenqubo eyodwa noma eliphindwe kabili). I-ultra-thin composite substrate inokusebenza okuhle kakhulu kokufakwa kukagesi, ukushibilika okuphezulu kwe-thermal, indawo enhle kakhulu yokubhula ethambile namandla okunamathela okuphezulu, futhi ingaqopha zonke izinhlobo zezithombe njengebhodi le-PCB, elinamandla okuthwala amanje. Ngakho-ke, i-ceramic substrate isiphenduke into eyisisekelo yobuchwepheshe besakhiwo sesekethe ye-elekthronikhi kanye nobuchwepheshe bokuxhumana.

Inzuzo yebhodi le-ceramic esekelwe:

Ukucindezeleka okunamandla kwemishini, ukuma okuzinzile; Amandla aphezulu, izinga eliphezulu le-thermal conductivity, ukufakwa okuphezulu; Ukunamathela okuqinile, i-anti-corrosion.

◆ Ukusebenza kahle komjikelezo wokushisa, izikhathi zomjikelezo kuze kube izikhathi ezingu-50,000, ukwethembeka okuphezulu.

◆ Isakhiwo semifanekiso ehlukahlukene singabhalwa njenge-PCB (noma i-IMS substrate); Akukho ukungcola, akukho ukungcola.

◆ Izinga lokushisa lesevisi lingu-55℃ ~ 850℃; I-coefficient yokwandisa okushisayo iseduze ne-silicon, eyenza inqubo yokukhiqiza yemojuli yamandla ibe lula.

Ukusetshenziswa kwebhodi le-ceramic esekelwe:

Ama-substrates e-Ceramic (i-alumina, i-aluminium nitride, i-silicon nitride, i-zirconia ne-zirconia toughening alumina okuyi-ZTA) ngenxa yezakhiwo zayo ezinhle kakhulu ezishisayo, zomshini, zamakhemikhali, kanye ne-dielectric, zisetshenziswa kabanzi ku-semiconductor chip packaging, izinzwa, i-electronics yezokuxhumana, omakhalekhukhwini kanye enye itheminali ehlakaniphile, amathuluzi namamitha, amandla amasha, umthombo wokukhanya omusha, ujantshi we-auto high-speed, amandla omoya, amarobhothi, i-aerospace nezempi yezokuvikela kanye nezinye izinkambu zobuchwepheshe obuphezulu . Ngokusho kwezibalo, minyaka yonke inani le-ceramic substrate elihlukahlukene lifinyelele amashumi ezigidigidi zemakethe, ikakhulukazi eminyakeni yamuva, ngentuthuko esheshayo yaseChina ezimotweni zamandla amasha, isitimela esinesivinini esikhulu kanye neziteshi ezingu-5 g, isidingo se-ceramic substrate sikhulu, kuphela emotweni. endaweni, inani lesidingo unyaka ngamunye lifinyelela ku-5 million PCS; I-substrate ye-alumina ceramic ayisetshenziswa kabanzi embonini kagesi neye-elekthronikhi kuphela, kodwa futhi kunzwa yokucindezela kanye nenkambu yokukhipha ukushisa kwe-LED.

Isetshenziswa kaningi kulezi zindawo ezi-5 ezilandelayo:

Imojula ye-1.IGBT yesitimela esinesivinini esikhulu, izimoto ezintsha zamandla, ukukhiqiza amandla omoya, amarobhothi kanye neziteshi eziyisisekelo ze-5G;

2.Smart phone backplane kanye nokuqashelwa zeminwe;

3.Amaseli kaphethiloli aqinile esizukulwane esisha;

4.Inzwa entsha ye-flat plate pressure kanye nenzwa ye-oxygen;

I-5.LD/LED yokushisa ukushisa, uhlelo lwe-laser, isifunda esihlanganisiwe esihlanganisiwe;


  • Okwedlule:
  • Olandelayo:

  • Bhala umyalezo wakho lapha futhi usithumelele wona

    IZIGABA ZOMKHIQIZO

    Gxila ekunikezeni izixazululo ze-mong pu iminyaka emi-5.