Competitive PCB Umkhiqizi

Ivolumu ephansi ye-PCB SMT Assembly

Incazelo emfushane:

I-SMT isifinyezo seSurface Mounted Technology, ubuchwepheshe obedume kakhulu nenqubo embonini yomhlangano we-elekthronikhi. Isifunda se-elekthronikhi iSurface Mount Technology (SMT) ibizwa ngeSurface Mount noma iSurface Mount Technology. Luhlobo lobuchwepheshe be-Circuit Assembly obufaka izingxenye zomhlangano wokuhola ongaholi noma omfushane (i-SMC / SMD ngesiShayina) ebusweni beBhodi Eliphrintiwe Lesifunda (i-PCB) noma enye indawo esezingeni eliphansi, bese lishisela futhi lihlangane ngokusebenzisa kabusha i-welding noma cwilisa Welding.


Imininingwane yomkhiqizo

Amathegi womkhiqizo

I-SMT isifinyezo seSurface Mounted Technology, ubuchwepheshe obedume kakhulu nenqubo embonini yomhlangano we-elekthronikhi. Isifunda se-elekthronikhi iSurface Mount Technology (SMT) ibizwa ngeSurface Mount noma iSurface Mount Technology. Luhlobo lobuchwepheshe be-Circuit Assembly obufaka izingxenye zomhlangano wokuhola ongaholi noma omfushane (i-SMC / SMD ngesiShayina) ebusweni beBhodi Eliphrintiwe Lesifunda (i-PCB) noma enye indawo esezingeni eliphansi, bese lishisela futhi lihlangane ngokusebenzisa kabusha i-welding noma cwilisa Welding.

Ngokuvamile, imikhiqizo ye-elektroniki esiyisebenzisayo yenziwe nge-PCB kanye nama-capacitors ahlukahlukene, ama-resistor nezinye izinto ze-elekthronikhi ngokusho komdwebo wesekethe, ngakho-ke zonke izinhlobo zemishini kagesi zidinga ubuchwepheshe obuhlukahlukene bokucubungula i-SMT ukucubungula.

Izakhi zenqubo eyisisekelo ye-SMT zifaka phakathi: ukuphrinta kwesikrini (noma ukuhambisa), ukufaka (ukuphilisa), ukufaka kabusha i-welding, ukuhlanza, ukuhlola, ukulungisa.

1. Ukuphrinta kwesikrini: Umsebenzi wokuphrinta kwesikrini ukuvuza ukunamathisela kwe-solder noma ukunamathisela kwe-patch ku-solder pad ye-PCB ukulungiselela ukufakwa kwezingxenye. Imishini esetshenzisiwe umshini wokuphrinta wesikrini (umshini wokuphrinta wesikrini), otholakala ekugcineni komugqa wokukhiqiza we-SMT.

2. Ukufuthwa kwe-glue: Iwisa i-glue endaweni elungisiwe yebhodi le-PCB, futhi umsebenzi wayo omkhulu ukulungisa izingxenye zebhodi le-PCB. Imishini esetshenzisiwe ngumshini wokuhambisa, otholakala ekugcineni komugqa wokukhiqiza we-SMT noma ngemuva kwemishini yokuhlola.

3. Mount: Umsebenzi wayo ukufaka izingxenye zomhlangano womhlaba ngokunembile endaweni ehleliwe ye-PCB. Imishini esetshenzisiwe ngumshini wokubekwa kwe-SMT, otholakala ngemuva komshini wokuphrinta wesikrini kulayini wokukhiqiza we-SMT.

4.Ukuphulukisa: Umsebenzi wawo ukuncibilikisa ukunamathela kwe-SMT ukuze izingxenye zomhlangano womhlaba kanye nebhodi le-PCB likwazi ukunamathela ngokuqinile ndawonye. Imishini esetshenzisiwe yelapha isithando somlilo, esingemuva kolayini wokukhiqiza we-SMT SMT.

5. Ukugeleza kwe-Reflow: umsebenzi we-welding reflow ukuncibilikisa ukunamathisela kwe-solder, ukuze izingxenye zomhlangano womhlaba kanye nebhodi le-PCB linamathele ndawonye. Isisetshenziswa esisetshenziswayo yisithando somlilo esivuselelayo, esisemgqeni wokukhiqiza we-SMT ngemuva komshini wokubekwa kwe-SMT.

6. Ukuhlanza: Umsebenzi ukususa izinsalela zokushisela njengokufuduka kwi-PCB ehlanganisiwe eyingozi emzimbeni womuntu. Imishini esetshenzisiwe umshini wokuhlanza, isikhundla asikwazi ukulungiswa, kungaba ku-inthanethi, noma cha ku-inthanethi.

7. Ukutholwa: Isetshenziselwa ukuthola ikhwalithi ye-welding nekhwalithi yomhlangano we-PCB ehlanganisiwe. Okokusebenza okusetshenzisiwe kufaka phakathi ukukhulisa ingilazi, imicroscope, insimbi yokuhlola on-line (ICT), insimbi yokuhlola inaliti endizayo, ukuhlolwa okuzenzakalelayo kwe-optical (AOI), uhlelo lokuhlola i-X-ray, ithuluzi lokuhlola elisebenzayo, njll. Indawo ingalungiswa endaweni efanele ingxenye yolayini wokukhiqiza ngokuya ngezidingo zokuhlolwa.

8.Lungisa: isetshenziselwa ukwenza kabusha i-PCB etholwe ngamaphutha. Amathuluzi asetshenzisiwe ayizinsimbi ezi-soldering, izindawo zokusebenzela zokulungisa, njll. Ukucushwa kukuyo yonke indawo kulayini wokukhiqiza.


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