Competitive PCB Umkhiqizi

Iphrojekthi Okuqukethwe Amandla

1

Ukuhlukaniswa kwebhodi I-Aluminium Base, i-Copper BaseXrom Base, i-ceramics base yethusi-cfed, i-Combined Bade Board

2

impahla I-Demostic Aluminium. Ithusi lasekhaya, i-aluminium engenisiwe, ithusi elingenisiwe

3

 ukwelashwa komhlaba I-HASL / ENIG / OSP / sikering

4

 ungqimba akhawunti uhlangothi-ibhodi le-pnnted / ibhodi ephrintiwe emaceleni amabili

5

Usayizi webhodi 1200mm * 480m (n

6

Ubukhulu bebhodi 5mm * 5mm

7

ulayini ububanzi / apsce Usayizi: 0.1mnV0.1mm

8

i-warp ne-twist <= 0.5% (tfiickness: 1 .Omm, Ibhodi Usayizi: 300mm * 300mm)

9

ukujiya kwebhodi 0.5mm-5.0mm

10

ukujiya kwesiwula sobhedu 35urrV70um / 105um / 140um / 175unV210um / 245um / 280um / 315um / 35Qjm

11

ukubekezelelana Umzila we-CNC: ± 0.1 mm; isibhakela: 士 0.1 mm

12

Ukubhaliswa kwe-V-CUT ± 0.1mm

13

Hole odongeni zethusi ukujiya 20um-35um

14

Ukubhaliswa kwe-Mm kwesikhundla somgodi (i-campare enedatha ye-CAD) ± 3mil (10.076mm)

15

Imbobo yokubhoboza I-1.0mm (ubukhulu beBhodi bebw1.0mmr 1.0mm)

16

Min.punching isikwele slot (Ukujiya kweBhodi ngezansi kwe-1 .Omm, 1.0mm * 1 .Omm)

17

Ukubhaliswa kwesekethe ephrintiwe ± 0.076mm

18

Ububanzi bomgodi wamaminerali 0.6mm

19

ukushuba kokwelashwa kwendawo Plating igolide: Ni 4um-6um> Au0.1um-0.5umENIG: Ni 5um-6um, Au: 0.0254um-0.127umisiliva: Ag3um-8um

I-HASL: 40um-1 OOum

20

V-CUTi degree ukubekezelelana (Isiqu)

21

V-SIKA ibhodi ukushuba 0.6mm-4.0mm

22

Ububanzi be-Min 0.15mm

23

Kuvulwa imaski yeSoldor 0.35mm