Competitive PCB Umkhiqizi

Hlunga izinto Amandla ajwayelekile Ikhono elikhethekile

ukubalwa kwesendlalelo

Ngesandla Esiqinile-flex PCB 2-14 2-24
  I-Flex PCB 1-10 1-12

ibhodi

  0.08 +/- 0.03mm 0.05 +/- 0.03mm
  Ubuncane. Ubukhulu    
  UMax. Ubukhulu 6mm 8mm
  UMax. Usayizi 485mm * 1000mm 485mm * 1500mm
I-Hole & Slot Ubuncane 0.15mm 0.05mm
  Min.Slot Hole 0.6mm 0.5mm
  Ukubukeka kwesilinganiselo

10:01

12:01

Landelela Ububanzi / Isikhala 0.05 / 0.05mm 0.025 / 0.025mm
Ukubekezelelana Landelela i-W / S ± 0.03mm ± 0.02mm
    (W / S≥0.3mm: ± 10%) (W / S≥0.2mm: ± 10%)
  Imbobo imbobo ± 0.075mm ± 0.05mm
  Ubukhulu beHole ± 0.075mm ± 0.05mm
  Impedance 0 ≤ Inani ≤ 50Ω: ± 5Ω 50Ω ≤ Inani: ± 10% Ω  
Izinto Ukucaciswa kwe-Basefilm PI: 3mil 2mil 1mil 0.8mil 0.5mil  
    I-ED &RA Cu: 2OZ 1OZ 1 / 2OZ 1 / 3OZ 1 / 4OZ  
  Umhlinzeki we-Basefilm Main Shengyi / Taiflex / Dupont / Doosan / Thinflex  
  Imininingwane Yesembozo PI: 2mil 1mil 0.5mil  
  Umbala we-LPI Luhlaza / Ophuzi / Mhlophe / Mnyama / Luhlaza / Bomvu  
  I-PI Stiffener T: 25um ~ 250um  
  I-FR4 Stiffener T: 100um - 2000um  
  I-SUS Stiffener T: 100um ~ 400um  
  AL Stiffener T: 100um ~ 1600um  
  Tape 3M / Tesa / Nitto  
  Ukuvikelwa kwe-EMI Ifilimu lesiliva / i-Copper / inki yesiliva  
Surface sekugcineni I-OSP 0.1 - 0.3um  
  I-HASL Sn: 5um - 40um  
  I-HASL (Leed mahhala) Sn: 5um - 40um  
  ENEPIG UNi: 1.0 - 6.0um  
    Ba: 0.015-0.10um  
    I-Au: 0.015 - 0.10um  
  Plating igolide kanzima UNi: 1.0 - 6.0um  
    I-Au: 0.02um - 1um  
  Flash igolide UNi: 1.0 - 6.0um  
    I-Au: 0.02um - 0.1um  
  ENIG UNi: 1.0 - 6.0um  
    I-Au: 0.015um - 0.10um  
  Ukucwiliswa isiliva Isilinganiso: 0.1 - 0.3um  
  Plating Tin Sn: 5um - 35um  
SMT Thayipha Izixhumi ze-pitch ezingama-0.3mm  
    0.4mm iphimbo BGA / QFP / QFN  
    Ingxenye ye-0201