Competitive PCB Umkhiqizi

i-multilayer High Tg Board enebhizinisi lokucwiliswa kwegolide lemodemu

Incazelo emfushane:

Uhlobo lwento: FR4 Tg170

Isendlalelo: 4

Ububanzi besikhala / isikhala esincane: 6 mil

Min imbobo usayizi: 0.30mm

Iqedile ukujiya kwebhodi: 2.0mm

Iqedile ukujiya kwethusi: 35um

Qeda: ENIG

Umbala wesifiva sesolder: luhlaza “

Isikhathi sokuhola: izinsuku eziyi-12


Imininingwane yomkhiqizo

Amathegi womkhiqizo

Uhlobo lwento: FR4 Tg170

Isendlalelo: 4

Ububanzi besikhala / isikhala esincane: 6 mil

Min imbobo usayizi: 0.30mm

Iqedile ukujiya kwebhodi: 2.0mm

Iqedile ukujiya kwethusi: 35um

Qeda: ENIG

Umbala we-Solder mask: oluhlaza ''

Isikhathi sokuhola: izinsuku eziyi-12

High Tg board

Lapho izinga lokushisa lebhodi lesifunda eliphakeme le-Tg likhuphukela esifundeni esithile, i-substrate izoshintsha isuke ku- "state glass" iye ku- "state raber", futhi izinga lokushisa ngalesi sikhathi libizwa ngokuthi ukushisa kwengilazi lokuguqula ingilazi (Tg) kwepuleti. Ngamanye amagama, i-Tg yizinga lokushisa eliphakeme kakhulu (℃) lapho i-substrate ihlala iqinile khona. Okusho ukuthi, izinto ezijwayelekile ze-PCB substrate ekushiseni okuphezulu azikhiqizi kuphela ukuthamba, ukusonteka, ukuncibilika nezinye izinto, kepha futhi kukhombisa ukwehla okukhulu kwezakhiwo zemishini nezikagesi (angicabangi ukuthi ufuna ukubona imikhiqizo yazo ivela kuleli cala ).

Amapuleti ajwayelekile we-Tg angaphezulu kwama-degree ayi-130, i-Tg ephezulu imvamisa ingaphezu kwama-degree ayi-170, kanti i-Tg ephakathi icishe ibe ngaphezu kwama-degree ayi-150.

Imvamisa, i-PCB ene-Tg≥170 ℃ ibizwa ngokuthi ibhodi lesifunda eliphakeme le-Tg.

I-Tg ye-substrate iyanda, futhi ukumelana nokushisa, ukumelana nomswakama, ukumelana namakhemikhali, ukumelana nokuqina nezinye izici zebhodi lesifunda kuzothuthukiswa futhi kuthuthukiswe. Ukuphakama kwenani le-TG, kungcono ukusebenza kokumelana namazinga okushisa kwepuleti. Ikakhulukazi kunqubo engenakho ukuhola, i-TG ephezulu ivame ukusetshenziswa.

I-High Tg isho ukumelana nokushisa okuphezulu. Ngokuthuthuka okusheshayo komkhakha we-elekthronikhi, ikakhulukazi imikhiqizo ye-elektroniki emelwe ngamakhompyutha, maqondana nokuthuthukiswa komsebenzi ophakeme, i-multilayer ephezulu, isidingo se-PCB substrate material ukumelana nokushisa okuphezulu njengesiqinisekiso esibalulekile. Ukuvela nokuthuthuka kobuchwepheshe bokufakwa kwabantu obukhulu obumelwe yi-SMT kanye ne-CMT kwenza i-PCB incike kakhulu ekusekelweni kokumelana nokushisa okuphezulu kwe-substrate ngokwendlela yokuvula okuncane, intambo enhle nohlobo oluncane.

Ngakho-ke, umehluko phakathi kwe-FR-4 ejwayelekile kanye ne-high-TG FR-4 ngukuthi esimweni esishisayo, ikakhulukazi ngemuva kwe-hygroscopic nokufudumala, amandla womshini, ukuqina kobukhulu, ukunamathela, ukumunca amanzi, ukubola okushisayo, ukwanda okushisayo nezinye izimo izinto zihlukile. Imikhiqizo ephezulu ye-Tg ngokusobala ingcono kunezinto ezijwayelekile ze-PCB substrate. Eminyakeni yamuva, inani lamakhasimende adinga ibhodi lesifunda ephezulu le-Tg lenyukile unyaka nonyaka.


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