Competitive PCB Umkhiqizi

8.0W / mk ukushuba okuphezulu kokushisa kwe-MCPCB kwesibani sikagesi

Incazelo emfushane:

Uhlobo lwensimbi: Isisekelo se-Aluminium

Inani lezendlalelo: 1

Ubuso: Hhola mahhala HASL

Plate ukujiya: 1.5mm

Ubukhulu bethusi: 35um

Ukuqhuba Okushisayo: 8W / mk

Ukumelana nokushisa: 0.015 ℃ / W.


Imininingwane yomkhiqizo

Amathegi womkhiqizo

Isingeniso se-MCPCB

I-MCPCB isifinyezo sama-PCB ayisisekelo we-Metal, kufaka phakathi i-PCB esekwe nge-aluminium, i-PCB esekwe ngethusi ne-PCB esekwe ngensimbi.

I-Aluminium board board yilona uhlobo oluvame kakhulu. Izinto eziyisisekelo ziqukethe i-aluminium core, i-FR4 ejwayelekile nethusi. Ifaka ungqimba ogqokiwe oshisayo osakaza ukushisa ngendlela esebenza kahle ngenkathi izingxenye zokupholisa. Njengamanje, i-Aluminium PCB Ese-Aluminium ithathwa njengesixazululo samandla aphezulu. Ibhodi le-Aluminium elingasetshenziswa lingathatha indawo yebhodi le-ceramic elibonakalayo, futhi i-aluminium inikeza amandla nokuqina komkhiqizo ongasetshenziswa izisekelo ze-ceramic.

I-substrate yethusi ingenye yezinsimbi ezibiza kakhulu zensimbi, futhi ukuqhutshwa kwayo okushisayo kungcono kakhulu kaningi kunalokho okwenziwe ngama-aluminium substrates nezinsimbi zensimbi. Ilungele ukushabalalisa ukushisa okuphezulu kakhulu kwemijikelezo ephezulu, izinto ezisezifundeni ezinokuhlukahluka okukhulu ekushiseni okuphezulu naphansi kanye nemishini yokuxhumana ngokunemba.

Isendlalelo se-Thermal insulation ngenye yezingxenye eziyinhloko ze-substrate yethusi, ngakho-ke ubukhulu be-foil yethusi ikakhulu yi-35 m-280 m, engafinyelela amandla aqinile okuphatha njengamanje. Uma kuqhathaniswa ne-aluminium substrate, i-substrate yethusi ingafinyelela umphumela ongcono wokushisa ukushisa, ukuze kuqinisekiswe ukuzinza komkhiqizo.

Ukwakheka kwe-Aluminium PCB

Isendlalelo Sethusi Lesifunda

Isendlalelo sethusi sethusi sakhiwa futhi sagxila ukwakha isifunda esiphrintiwe, i-substrate ye-aluminium ingathwala amandla aphezulu kunama-FR-4 aminyene afanayo nobubanzi obulandelanayo obufanayo.

Ungqimba Wokuvikela

Isendlalelo esivikela ubuchwepheshe obuyisisekelo be-substrate ye-aluminium, edlala kakhulu imisebenzi yokwambathisa nokuqhuba ukushisa. Isendlalelo se-aluminium substrate sokuvikela ungqimba olukhulu lokushisa esakhiweni semodyuli yamandla. Kungcono ukuhanjiswa kokushisa kwesendlalelo sokuvikela, kuphumelela kakhulu ukusabalalisa ukushisa okwenziwe ngesikhathi sokusebenza kwedivayisi, futhi kwehlisa izinga lokushisa lwensimbi,

Insimbi engaphansi

Hlobo luni lwensimbi esizolukhetha njenge-substrate yensimbi evikela insimbi?

Sidinga ukubheka i-coefficient yokunwetshwa okushisayo, ukuqhutshwa kokushisa, amandla, ubulukhuni, isisindo, isimo somhlaba kanye nezindleko zensimbi yensimbi.

Imvamisa, i-aluminium ishibhile ngokuqhathaniswa kunethusi. Izinto ezitholakalayo ze-aluminium zingama-6061, 5052, 1060 njalonjalo. Uma kunezidingo eziphakeme zokuqhutshwa kokushisa, izakhiwo zemishini, izakhiwo zikagesi nezinye izakhiwo ezikhethekile, amapuleti ethusi, amapuleti wensimbi engagqwali, amapuleti wensimbi kanye namapuleti ensimbi e-silicon nawo angasetshenziswa.

Ukusetshenziswa kwe I-MCPCB

1. Umsindo: Okokufaka, okokukhulisa okukhiphayo, okokulinganisa okulinganiselayo, okhulisa umsindo, okhulisa amandla.

2. Ukunikezwa Kwamandla: Ishintsha isilawuli, isiguquli se-DC / AC, isilawuli se-SW, njll.

3.Izimoto: Isilawuli se-elektroniki, ukuthungela, isilawuli sokuhambisa ugesi, njll.

4. Ikhompyutha: CPU board, floppy disk drive, ugesi, njll.

5. Amamojula Amandla: Inverter, solid-state relays, rectifier bridges.

6. Amalambu nokukhanyisa: amalambu okonga ugesi, amalambu e-LED anemibala ehlukahlukene anemibala ehlukahlukene, amalambu angaphandle, amalambu esiteji, ukukhanya komthombo

MCPCB

I-8W / mK i-PCB esezingeni eliphakeme yokushisa kwe-aluminium

Uhlobo lwensimbi: Isisekelo se-Aluminium

Inani lezendlalelo: 1

Umphezulu: HASL yamahhala

Plate ukujiya: 1.5mm

Ukujiya yethusi: 35um

Ukuqhuba Okushisayo: 8W / mk

Ukumelana Thermal: 0.015 ℃ / W

Uhlobo lwensimbi: Aluminium isisekelo

Inani lezendlalelo: 2

Umphezulu: I-OSP

Plate ukujiya: 1.5mm

Ubukhulu bethusi: 35um

Uhlobo lwenqubo: I-substrate yethusi yokuhlukaniswa kwe-Thermoelectric

Ukuqhuba Okushisayo: 398W / mk

Ukumelana Thermal: 0.015 ℃ / W

Umqondo wokuklama: Umhlahlandlela wensimbi oqondile, indawo yokuxhumana nebhulokhi enkulu, futhi izintambo zincane.

MCPCB-1

  • Langaphambilini
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