Umkhiqizi we-PCB Wokuncintisana

I-MCPCB isifinyezo se-Metal core PCBs, okuhlanganisa i-PCB esekwe ku-aluminium, i-PCB esekwe ethusi kanye ne-PCB esekwe ngensimbi.

Ibhodi elisekelwe ku-aluminium liwuhlobo oluvame kakhulu. Isisekelo sezinto siqukethe i-aluminium core, i-FR4 ejwayelekile nethusi. Ifaka isendlalelo esigqoke esishisayo esihlakaza ukushisa ngendlela esebenza kahle kakhulu ngenkathi ipholisa izingxenye . Njengamanje, i-Aluminium Based PCB ithathwa njengesixazululo samandla aphezulu. Ibhodi elisekelwe ku-aluminium lingangena esikhundleni sebhodi le-ceramic elithambile, futhi i-aluminium inikeza amandla nokuqina kumkhiqizo izisekelo ze-ceramic ezingakwazi.

I-Copper substrate ingenye yezingxenye zensimbi ezibiza kakhulu, futhi ukuhamba kwayo okushisayo kungcono izikhathi eziningi kune-aluminium substrates kanye ne-iron substrates. Ifaneleka kahle kakhulu ekulahlekeni kokushisa kwamasekhethi aphezulu, izingxenye ezisezifundeni ezinokuhlukahluka okukhulu kwezinga lokushisa eliphezulu neliphansi kanye nemishini yokuxhumana enembile.

Isendlalelo se-thermal insulation singenye yezingxenye eziyinhloko ze-copper substrate, ngakho-ke ubukhulu be-copper foil ngokuvamile buyi-35 m-280 m, engafinyelela umthamo oqinile wokuthwala okwamanje. Uma kuqhathaniswa ne-aluminium substrate, i-copper substrate ingafinyelela umphumela ongcono wokulahla ukushisa, ukuze kuqinisekiswe ukuzinza komkhiqizo.

Isakhiwo se-Aluminium PCB

Circuit Copper Layer

Isendlalelo sethusi sesifunda siyathuthukiswa futhi siqoshwe ukuze sakhe isifunda esiphrintiwe, i-aluminium substrate ingathwala amandla amanje aphezulu kune-FR-4 efanayo efanayo kanye nobubanzi bokulandelela okufanayo.

I-Insulating Layer

Isendlalelo se-insulating ubuchwepheshe obuyinhloko be-aluminium substrate, edlala ngokuyinhloko imisebenzi yokufakelwa nokushisa. Ungqimba lwe-aluminium substrate insulating luyisithiyo esikhulu sokushisa esakhiweni semojula yamandla. Ukushisa okungcono kwe-thermal layer ye-insulating, kuphumelela kakhulu ukusabalalisa ukushisa okukhiqizwa ngesikhathi sokusebenza kwedivayisi, kanye nokunciphisa izinga lokushisa kwedivayisi,

I-Metal substrate

Hlobo luni lwensimbi esizolukhetha njenge-insulating metal substrate?

Kudingeka sicabangele i-coefficient yokwandisa okushisayo, ukuqhutshwa kwe-thermal, amandla, ubulukhuni, isisindo, isimo esiphezulu kanye nezindleko ze-substrate yensimbi.

Ngokuvamile, i-aluminium ishibhe kakhulu kunethusi. Izinto ezitholakalayo ze-aluminium ziyi-6061, 5052, 1060 nokunye. Uma kunezidingo eziphakeme ze-thermal conductivity, izakhiwo zemishini, izakhiwo zikagesi nezinye izinto ezikhethekile, amapuleti ethusi, amapuleti ensimbi engagqwali, amapuleti ensimbi kanye namapuleti ensimbi e-silicon angasetshenziswa.

Isicelo seI-MCPCB

1. Umsindo : Okokufaka, isikhulisi sesandisi esiphumayo, isikhulisi sesandisi esilinganiselwe, isikhulisi somsindo, isikhulisi samandla.

2. Ukunikezwa kwamandla: Isilawuli sokushintsha, isiguquli se-DC / AC, isilawuli se-SW, njll.

3. Izimoto: Isilawuli se-elekthronikhi, okokuthungela, isilawuli sokuphakelwa kwamandla, njll.

4. Ikhompyutha: Ibhodi le-CPU, i-floppy disk drive, amadivaysi okuphakela amandla, njll.

5. Amamojula Amandla: I-Inverter, ama-solid-state relays, amabhuloho alungisa kabusha.

6. Amalambu nokukhanyisa: amalambu okonga amandla, izibani ze-LED ezinemibala ehlukahlukene, ukukhanya kwangaphandle, ukukhanyisa esiteji, ukukhanya komthombo