Umkhiqizi we-PCB Wokuncintisana

Imbobo yokuxhuma i-resin i-Microvia Immersion silver HDI ene-laser drilling

Incazelo emfushane:

Uhlobo lwezinto: FR4

Isibalo sesendlalelo: 4

Ubuncane bobubanzi bokulandelela/isikhala: 4 mil

Usayizi wembobo encane: 0.10mm

Ugqinsi lwebhodi eliqediwe: 1.60mm

Ugqinsi lwethusi oluqediwe: 35um

Qeda: ENIG

Umbala wemaski we-Solder: blue

Isikhathi sokuhola: izinsuku eziyi-15


Imininingwane Yomkhiqizo

Omaka bomkhiqizo

Uhlobo lwezinto: FR4

Isibalo sesendlalelo: 4

Ubuncane bobubanzi bokulandelela/isikhala: 4 mil

Usayizi wembobo encane: 0.10mm

Ugqinsi lwebhodi eliqediwe: 1.60mm

Ugqinsi lwethusi oluqediwe: 35um

Qeda: ENIG

Umbala wemaski we-Solder: blue

Isikhathi sokuhola: izinsuku eziyi-15

HDI

Kusukela ngekhulu lama-20 kuya ekuqaleni kwekhulu lama-21, imboni ye-electronics board board idonsa isikhathi sokuthuthukiswa okusheshayo kobuchwepheshe, ubuchwepheshe be-elekthronikhi buye bathuthukiswa ngokushesha.Njengemboni yebhodi lesifunda ephrintiwe, ngokuthuthukiswa kwayo okuhambisanayo kuphela, ingahlangabezana nezidingo zamakhasimende njalo.Ngomthamo omncane, okhanyayo futhi omncane wemikhiqizo ye-elekthronikhi, ibhodi lesifunda eliphrintiwe lenze ibhodi eliguquguqukayo, ibhodi eliqinile eliguquguqukayo, ibhodi lesifunda elingcwatshwe imbobo eyimpumputhe nokunye.

Ukukhuluma ngemigodi ephuphuthekile/engcwatshiwe, siqala nge-multilayer yendabuko.Isakhiwo esijwayelekile sebhodi lesifunda se-multi-layer sakhiwe isifunda sangaphakathi kanye nesifunda sangaphandle, futhi inqubo yokubhoboza kanye ne-metalization emgodini isetshenziselwa ukufeza umsebenzi wokuxhuma kwangaphakathi kwesifunda ngasinye sesendlalelo.Kodwa-ke, ngenxa yokwanda kokuminyana komugqa, imodi yokupakisha yezingxenye ivuselelwa njalo.Ukuze kwenziwe indawo yebhodi lesifunda ibe nomkhawulo futhi ivumele izingxenye zokusebenza ezengeziwe neziphakeme, ngaphezu kobubanzi bomugqa omncane, indawo yokuvula incishisiwe isuka ku-1 mm ye-DIP yokuvula i-DIP yaya ku-0.6 mm ye-SMD, futhi yehliswa yaba ngaphansi 0.4mm.Kodwa-ke, indawo engaphezulu isazosetshenziswa, ngakho-ke imbobo egqitshiwe kanye nembobo eyimpumputhe ingakhiqizwa.Incazelo yembobo egqitshiwe kanye nembobo eyimpumputhe imi kanje:

Umgodi owakhiwe:

Imbobo ephakathi kwezingqimba zangaphakathi, ngemuva kokucindezela, ayikwazi ukubonakala, ngakho-ke ayidingi ukuhlala endaweni yangaphandle, izinhlangothi ezingenhla nezingezansi zomgodi zingaphakathi kwebhodi lebhodi, ngamanye amazwi, lingcwatshwe ebhodini. ibhodi

Imbobo ephuphuthekile:

Isetshenziselwa ukuxhumana phakathi kongqimba olungaphezulu kanye nesendlalelo esisodwa noma eziningi zangaphakathi.Olunye uhlangothi lwembobo luhlangothini olulodwa lwebhodi, bese imbobo ixhunywe ngaphakathi kwebhodi.

Inzuzo yebhodi lembobo eliphuphuthekile neligqitshwe:

Kubuchwepheshe bomgodi ongabhobozi, ukusetshenziswa kwembobo eyimpumputhe kanye nomgodi ongcwatshwe kunganciphisa kakhulu usayizi we-PCB, kunciphise inani lezendlalelo, kuthuthukise ukuhambisana kwe-electromagnetic, kukhuphule izici zemikhiqizo ye-elekthronikhi, kunciphise izindleko, futhi kwenziwe nomklamo. sebenza kalula futhi ngokushesha.Ekwakhiweni nasekucutshungulweni kwe-PCB yendabuko, umgodi wokudlula ungadala izinkinga eziningi.Okokuqala, bathatha indawo enkulu esebenzayo.Okwesibili, inqwaba yezimbobo endaweni eminyene iphinde ibangele izithiyo ezinkulu ekufakweni kwezintambo kongqimba lwangaphakathi lwe-PCB enezingqimba eziningi.Lezi zimbobo zithatha isikhala esidingekayo ukuze kufakwe izintambo, futhi zidlula ngokuminyene ebusweni bomthombo wamandla kanye nongqimba lwentambo yaphansi, okuzocekela phansi izici zokuvimbela ungqimba lwentambo yaphansi yokuphakelwa kwamandla futhi kubangele ukwehluleka kwentambo yaphansi yokuphakela amandla. ungqimba.Futhi ukumba okuvamile kwemishini kuzoba izikhathi ezingu-20 kunokusebenzisa ubuchwepheshe bemigodi engabhobozi.


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