Competitive PCB Umkhiqizi

Resin wokufaka imbobo Microvia Ukucwiliswa isiliva HDI nge laser imishini

Incazelo emfushane:

Uhlobo lwento: FR4

Isendlalelo: 4

Ububanzi besikhala / isikhala esincane: 4 mil

Min imbobo usayizi: 0.10mm

Iqedile ukujiya kwebhodi: 1.60mm

Iqedile ukujiya kwethusi: 35um

Qeda: ENIG

Umbala wesifiva sesolder: oluhlaza okwesibhakabhaka

Isikhathi sokuhola: izinsuku eziyi-15


Imininingwane yomkhiqizo

Amathegi womkhiqizo

Uhlobo lwento: FR4

Isendlalelo: 4

Ububanzi besikhala / isikhala esincane: 4 mil

Min imbobo usayizi: 0.10mm

Iqedile ukujiya kwebhodi: 1.60mm

Iqedile ukujiya kwethusi: 35um

Qeda: ENIG

Umbala wesifiva sesolder: oluhlaza okwesibhakabhaka

Isikhathi sokuhola: izinsuku eziyi-15

HDI

Kusukela ngekhulu lama-20 kuye ekuqaleni kwekhulu lama-21, imboni yebhodi yesekethe ye-elekthronikhi idla isikhathi sokuthuthuka kwezobuchwepheshe, ubuchwepheshe be-elekthronikhi buthuthukiswe ngokushesha okukhulu. Njengemboni yebhodi yesifunda ephrintiwe, kuphela ngentuthuko yayo evumelanisiwe, engahlala ihlangabezana nezidingo zamakhasimende. Ngomthamo omncane, okhanyayo futhi omncane wemikhiqizo kagesi, ibhodi lesifunda eliphrintiwe lithuthukise ibhodi eliguquguqukayo, ibhodi eliguquguqukayo eliqinile, ibhodi lesifunda lomgodi elingaboni eliyimpumputhe njalonjalo.

Ukukhuluma ngezimbobo ezingaboni noma ezingcwatshwe, siqala ngemultilayer yendabuko. Isakhiwo sebhodi lesifunda esinamasendlalelo amaningi sakhiwa isifunda sangaphakathi nesekethe elingaphandle, futhi inqubo yokubhola nokufaka izinsimbi emgodini isetshenziselwa ukufeza umsebenzi wokuxhumeka kwangaphakathi kwesekethe yesendlalelo ngasinye. Kodwa-ke, ngenxa yokwanda kobuningi bomugqa, imodi yokupakisha yezingxenye ivuselelwa njalo. Ukuze kwenziwe indawo yebhodi lesifunda ikhawulelwe futhi ivumele izingxenye ezengeziwe neziphezulu zokusebenza, ngaphezu kobubanzi bomugqa omncane, ukuvula kwehlisiwe kusuka ku-1 mm we-DIP jack ukuvula kuya ku-0.6 mm we-SMD, futhi kwehliswa kancane kwaba ngaphansi kuka 0.4mm. Kodwa-ke, indawo engaphezulu isazohlala abantu, ngakho-ke kungakhiwa umgodi wembobo nomgodi oyimpumputhe. Incazelo yomgodi ongcwatshwe nomgodi oyimpumputhe imi kanjena:

Umgodi owakhiwe:

Umgodi odabula phakathi kwezendlalelo zangaphakathi, ngemuva kokucindezela, awubonakali, ngakho-ke awudingi ukungena endaweni engaphandle, izinhlangothi ezingenhla nezingezansi zomgodi zisengxenyeni engaphakathi yebhodi, ngamanye amagama, zingcwatshwe ibhodi

Imbobo Blinded:

Isetshenziselwa ukuxhumana phakathi kwesendlalelo sendawo nengqimba eyodwa noma ngaphezulu yangaphakathi. Uhlangothi olulodwa lomgodi lungakolunye uhlangothi lwebhodi, bese umgodi uxhunywe ngaphakathi kwebhodi.

Ubuhle bebhodi lomgodi ongaboni futhi wangcwatshwa:

Kwezobuchwepheshe bomgodi ongagobhozi, ukusetshenziswa komgodi oyimpumputhe nomgodi ongcwatshwe kunganciphisa kakhulu usayizi we-PCB, kunciphise inani lezendlalelo, kuthuthukise ukuhambisana kwe-electromagnetic, kukhulise izici zemikhiqizo kagesi, kunciphise izindleko, futhi kwenziwe nomklamo sebenza ngokulula nangaphezulu. Ekudizayinweni nasekucutshungweni kwendabuko kwe-PCB, ukungena emgodini kungadala izinkinga eziningi. Okokuqala, bahlala endaweni enkulu esebenzayo. Okwesibili, inani elikhulu lezimbobo ezisendaweni eshinyene nalo lidala izithiyo ezinkulu ekuxhumaneni kocingo lwangaphakathi lwe-PCB enezingqimba eziningi. Lezi zimbobo ezingena emigodini zihlala esikhaleni esidingekayo sokwenza izintambo, futhi zidlula kakhulu ebusweni bokuphakelwa kwamandla kanye nocingo lwentambo yomhlabathi, oluzoqeda izici zempedance yongqimba lwentambo kagesi yomhlabathi futhi lubangele ukwehluleka kocingo lwaphansi lokuphakelwa kwamandla ungqimba. Futhi imishini ejwayelekile yokubhola izophindeka izikhathi ezingama-20 kunokusebenzisa ubuchwepheshe bomgodi ongagobhozi.


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