Umkhiqizi we-PCB Wokuncintisana

I-SMT isifinyezo se-Surface Mounted Technology, Ubuchwepheshe obudume kakhulu kanye nenqubo embonini yokuhlanganisa i-electronic. I-Electronic circuit Surface Mount Technology (SMT) ibizwa ngokuthi i-Surface Mount noma i-Surface Mount Technology. Iwuhlobo lobuchwepheshe bokuhlanganisa iSekethe obufaka izinto zokuhlangana ezingadoli noma ezimfishane (i-SMC/SMD ngesiShayina) endaweni Yebhodi Lesifunda Eliphrintiwe (PCB) noma enye indawo engaphansi, bese ishisela futhi ihlanganiswe ngendlela yokushisela noma dip welding.

Ngokuvamile, imikhiqizo ye-elekthronikhi esiyisebenzisayo yenziwe nge-PCB kanye nama-capacitor ahlukahlukene, ama-resistors nezinye izakhi ze-elekthronikhi ngokomdwebo wesifunda, ngakho-ke zonke izinhlobo zezinto zikagesi zidinga ubuchwepheshe obuhlukahlukene bokucubungula ama-chip e-SMT ukuze zicutshungulwe.

Izinqubo eziyisisekelo ze-SMT zihlanganisa: ukuphrinta isikrini (noma ukusatshalaliswa), ukukhweza (ukwelapha), ukushisela kabusha, ukuhlanza, ukuhlola, ukulungisa.

1. Ukuphrinta isikrini: Umsebenzi wokuphrinta isikrini ukuvuza i-solder paste noma ukunamathisela okunamathelayo kuphedi ye-PCB ye-solder ukulungiselela ukushiselwa kwezinto. Izinto ezisetshenziswayo umshini wokunyathelisa isikrini (umshini wokunyathelisa isikrini), otholakala ekugcineni komugqa wokukhiqiza we-SMT.

2. Glue spraying: Iwisa iglue endaweni engaguquki yebhodi le-PCB, futhi umsebenzi wayo oyinhloko ukulungisa izingxenye ebhodini le-PCB. Imishini esetshenziswayo umshini wokukhipha, otholakala ekugcineni komugqa wokukhiqiza we-SMT noma ngemuva kwemishini yokuhlola.

3. I-Mount: Umsebenzi wayo ukufaka izingxenye zokuhlanganisa ezingaphezulu ngokunembile endaweni egxilile ye-PCB. Izinto ezisetshenziswayo umshini wokubeka we-SMT, otholakala ngemuva komshini wokuphrinta isikrini ku-THE SMT production line.

4. Ukwelapha: Umsebenzi wawo ukuncibilikisa okunamathelayo kwe-SMT ukuze izingxenye zomhlangano ongaphezulu kanye nebhodi le-PCB kubambelele ngokuqinile ndawonye. Izinto ezisetshenziswayo ukulapha isithando somlilo, esitholakala ngemuva komugqa wokukhiqiza we-SMT SMT.

5. I-Reflow welding: umsebenzi we-reflow welding ukuncibilikisa ukunamathisela kwe-solder, ukuze izingxenye zomhlangano ongaphezulu kanye nebhodi le-PCB kunamathele ndawonye. Imishini esetshenziswayo i-reflow welding furnace, etholakala kulayini wokukhiqiza we-SMT ngemuva komshini wokubeka we-SMT.

6. Ukuhlanza: Umsebenzi ukususa izinsalela zokushisela ezifana nokugeleza ku-PCB ehlanganisiwe eyingozi emzimbeni womuntu. Imishini esetshenziswayo umshini wokuhlanza, isikhundla asikwazi ukulungiswa, kungaba ku-inthanethi, noma ku-inthanethi.

7. Ukutholwa: Kusetshenziselwa ukuthola ikhwalithi yokushisela kanye nekhwalithi yokuhlanganisa ye-PCB ehlanganisiwe. Izinto ezisetshenziswayo zihlanganisa ingilazi yokukhulisa, isibonakhulu, ithuluzi lokuhlola ku-inthanethi (ICT), ithuluzi lokuhlola inaliti endizayo, ukuhlola okuzenzakalelayo kokubona (AOI), isistimu yokuhlola i-X-ray, ithuluzi lokuhlola elisebenzayo, njll. Indawo ingalungiselelwa ngendlela efanele. ingxenye yomugqa wokukhiqiza ngokwezidingo zokuhlola.

8.Ukulungisa: isetshenziselwa ukulungisa kabusha i-PCB etholwe inamaphutha. Amathuluzi asetshenziswayo ama-ayina okunamathisela, ukulungisa izindawo zokusebenza, njll. Ukucushwa kukhona noma yikuphi kulayini wokukhiqiza.