Umkhiqizi we-PCB Wokuncintisana

Isaziso sokubamba “Ubuchwepheshe Bokuhlaziya Ukwehluleka Kwengxenye Nekesi Lokuzilolonga” Ukuhlaziywa kwesicelo Isemina Enkulu

Isikhungo sesihlanu se-Electronics, uMnyango Wezimboni Nobuchwepheshe Bolwazi

Amabhizinisi nezikhungo:

Ukuze usize onjiniyela nochwepheshe babe yingcweti kubunzima bokusebenza nezisombululo zokuhlaziywa kokwehluleka kwengxenye kanye nokuhlaziywa kokwehluleka kwe-PCB&PCBA ngesikhathi esifushane;Siza abasebenzi abafanelekile ebhizinisini ukuthi baqonde ngokuhlelekile futhi bathuthukise ileveli yobuchwepheshe efanele ukuze kuqinisekiswe ukufaneleka nokwethembeka kwemiphumela yokuhlolwa.I-Fifth Institute of Electronics of the Ministry of Industry and Information Technology (MIIT) yabanjwa ngesikhathi esisodwa ku-inthanethi futhi ingaxhunyiwe ku-inthanethi ngoNovemba 2020 ngokulandelanayo:

1. Ukuvumelanisa okuku-inthanethi nokungaxhunyiwe ku-inthanethi "Kwezobuchwepheshe Zokuhlaziya Ukwehluleka Nezimo Ezingokoqobo" Ukuhlaziywa kwesicelo Ishabhu enkulu yokusebenzela.

2. Ephethwe izingxenye ze-elekthronikhi ze-PCB&PCBA ukuhlaziya ukwehluleka ukuhlaziya isimo sobuchwepheshe sokuhlaziya ukuvumelanisa okuku-inthanethi nokungaxhunyiwe ku-inthanethi.

3. Ukuvumelanisa okuku-inthanethi nokungaxhunyiwe ku-inthanethi kokuhlolwa kokwethembeka kwemvelo kanye nokuqinisekiswa kwenkomba yokwethembeka kanye nokuhlaziywa okujulile kokuhluleka komkhiqizo we-elekthronikhi.

4. Singaklama izifundo futhi sihlele ukuqeqeshwa kwangaphakathi kwamabhizinisi.

Okuqukethwe Kokuqeqesha:

1. Isingeniso sokuhlaziya ukwehluleka;

2. Ubuchwepheshe bokuhlaziya ukwehluleka kwezingxenye ze-elekthronikhi;

2.1 Izinqubo eziyisisekelo zokuhlaziya ukwehluleka

2.2 Indlela eyisisekelo yokuhlaziya okungabhubhisi

2.3 Indlela eyisisekelo yokuhlaziya okulimaza kancane

2.4 Indlela eyisisekelo yokuhlaziya okulimazayo

2.5 Inqubo yonke yokuhlaziywa kwecala lokwehluleka

2.6 Ubuchwepheshe be-Failure physics buzosetshenziswa emikhiqizweni esuka ku-FA kuya ku-PPA kanye ne-CA

3. Imishini yokuhlaziya ukwehluleka okujwayelekile kanye nemisebenzi;

4. Izindlela zokwehluleka okuyinhloko kanye nendlela yokwehluleka ngokwemvelo yezingxenye ze-elekthronikhi;

5. Ukuhlaziywa kokwehluleka kwezingxenye ezinkulu ze-elekthronikhi, izimo zakudala zokukhubazeka kwempahla (ukukhubazeka kwe-chip, ukukhubazeka kwekristalu, amaphutha engqimba ye-chip passivation, ukonakala kwebhondi, ukukhubazeka kwenqubo, ukonakala kwe-chip bonding, amadivaysi e-RF angenisiwe - ukukhubazeka kwesakhiwo esishisayo, ukukhubazeka okukhethekile, isakhiwo esingokwemvelo, ukukhubazeka kwesakhiwo sangaphakathi, ukukhubazeka kwempahla; Ukumelana, amandla, i-inductance, i-diode, i-triode, i-MOS, i-IC, i-SCR, imojula yesekethe, njll.)

6. Ukusetshenziswa kokwehluleka kobuchwepheshe befiziksi ekwakhiweni komkhiqizo

6.1 Amacala okuhluleka okubangelwa ukwakheka kwesekethe okungafanele

6.2 Amacala okuhluleka okubangelwa ukuvikeleka kokudlulisela okungalungile kwesikhathi eside

6.3 Amacala okuhluleka okubangelwa ukusetshenziswa kabi kwezingxenye

6.4 Amacala okuhluleka okubangelwa ukushiyeka kokuhambisana kwesakhiwo somhlangano nezinto zokwakha

6.5 Amacala okuhluleka ukuguquguquka kwemvelo kanye nokukhubazeka kwephrofayili yenhloso

6.6 Amacala okuhluleka okubangelwa ukufanisa okungafanele

6.7 Amacala okuhluleka okubangelwa ukwakheka okungafanele kokubekezelelana

6.8 Indlela esetshenziswayo kanye nobuthakathaka bemvelo bokuvikela

6.9 Ukwehluleka okubangelwa ukusabalalisa kwepharamitha yengxenye

6.10 IZIMO ZOKUHLULEKA ezibangelwa ukukhubazeka kwe-PCB design

6.11 Amacala okuhluleka okubangelwa ukukhubazeka kokuklama angenziwa