Ukukhiqizwa kwamabhodi esekethe e-PCB asezingeni eliphezulu akudingi nje ukutshalwa kwezimali okuphezulu kwezobuchwepheshe nemishini, kodwa futhi kudinga ukuqoqwa kokuhlangenwe nakho kochwepheshe nabasebenzi bokukhiqiza. Kunzima kakhulu ukucubungula kunamabhodi wesifunda anezingqimba eziningi zendabuko, futhi izidingo zayo zekhwalithi nokuthembeka ziphezulu.
1. Ukukhetha izinto ezibonakalayo
Ngokuthuthukiswa kwezingxenye ze-elekthronikhi ezisebenza kahle nezisebenzayo eziningi, kanye nokudluliswa kwesignali ye-high-frequency kanye nesivinini esikhulu, izinto zesifunda se-elekthronikhi ziyadingeka ukuze zibe nokulahlekelwa okuphansi kwe-dielectric kanye nokulahlekelwa kwe-dielectric, kanye ne-CTE ephansi kanye nokumuncwa kwamanzi aphansi. . isilinganiso kanye nezinto ezingcono zokusebenza eziphezulu ze-CCL ukuze kuhlangatshezwane nezidingo zokucubungula nokuthembeka kwamabhodi aphakeme kakhulu.
2. Isakhiwo esine-laminated design
Izici eziyinhloko ezicatshangelwe ekwakhiweni kwesakhiwo se-laminated ukumelana nokushisa, ukumelana ne-voltage, inani lokugcwaliswa kweglue kanye nokuqina kongqimba lwe-dielectric, njll. Izimiso ezilandelayo kufanele zilandelwe:
(1) Abakhiqizi bebhodi abangaphambi kwangaphambi naphakathi kufanele bahambisane.
(2) Uma ikhasimende lidinga ishidi le-TG ephezulu, ibhodi eliwumgogodla kanye ne-prepreg kufanele kusetshenziswe impahla ye-TG ephezulu ehambisanayo.
(3) I-substrate yesendlalelo sangaphakathi ingu-3OZ noma ngaphezulu, futhi i-prepreg enokuqukethwe kwe-resin ephezulu ikhethiwe.
(4) Uma ikhasimende lingenazo izidingo ezikhethekile, ukubekezelelana kokuqina kwe-interlayer dielectric layer ngokuvamile kulawulwa ngu-+/-10%. Ngepuleti le-impedance, ukubekezelela ukushuba kwe-dielectric kulawulwa ukubekezelelana kwekilasi le-IPC-4101 C/M.
3. Ukulawula ukuqondanisa kwe-Interlayer
Ukunemba kwesinxephezelo sikasayizi webhodi eliwumgogodla wesendlalelo sangaphakathi kanye nokulawulwa kosayizi wokukhiqiza kudingeka kunxeshezelwe ngokunembile ngosayizi wesithombe sesendlalelo ngasinye sebhodi eliphakeme ngedatha eqoqwe ngesikhathi sokukhiqiza kanye nolwazi olungokomlando lwedatha ethile. isikhathi sokuqinisekisa ukunwetshwa nokufinyezwa kwebhodi eliwumgogodla wesendlalelo ngasinye. ukungaguquguquki.
4. Ubuchwepheshe besifunda sesendlalelo sangaphakathi
Ukuze kukhiqizwe amabhodi aphakeme kakhulu, umshini wokuthwebula we-laser direct imaging (LDI) ungethulwa ukuze uthuthukise ikhono lokuhlaziya ihluzo. Ukuze kuthuthukiswe ikhono lokuqopha umugqa, kuyadingeka ukunikeza isinxephezelo esifanele kububanzi bomugqa kanye nephedi ekwakhiweni kobunjiniyela, futhi uqinisekise ukuthi isinxephezelo sokuklama sobubanzi bomugqa wongqimba ongaphakathi, isikhala somugqa, usayizi wendandatho yokuhlukaniswa, umugqa ozimele, kanye nebanga lomgodi ukuya kumugqa linengqondo, ngaphandle kwalokho shintsha ukwakheka kobunjiniyela.
5. Inqubo yokucindezela
Njengamanje, izindlela zokubeka i-interlayer ngaphambi kwe-lamination ikakhulukazi zifaka: ukuma kwe-slot ezine (Pin LAM), i-hot melt, i-rivet, i-hot melt kanye nenhlanganisela ye-rivet. Izakhiwo zomkhiqizo ezehlukene zisebenzisa izindlela zokubeka ezihlukene.
6. Inqubo yokumba
Ngenxa yokuma okuphezulu kwesendlalelo ngasinye, ungqimba lwepuleti nolwethusi kuminyene kakhulu, okuzogqokisa i-drill bit futhi kuphule kalula i-blade yokubhoboza. Inombolo yezimbobo, isivinini sokudonsa kanye nesivinini sokuzungeza kufanele kulungiswe ngokufanele.
Isikhathi sokuthumela: Sep-26-2022