Hlunga | izinto | Amandla ajwayelekile | Amandla akhethekile |
inani lesendlalelo | I-PCB eguquguqukayo eqinile | 2-14 | 2-24 |
I-Flex PCB | 1-10 | 1-12 | |
ibhodi | 0.08 +/- 0.03mm | 0.05 +/- 0.03mm | |
Okuncane.Ubukhulu | |||
Ubukhulu.Ubukhulu | 6mm | 8mm | |
Ubukhulu.Usayizi | 485mm * 1000mm | 485mm * 1500mm | |
Imbobo & Isikhala | Imbobo encane | 0.15mm | 0.05mm |
Min.Slot Hole | 0.6mm | 0.5mm | |
I-Aspect ratio | 10:01 | 12:01 | |
Landela | Ubuncane.Ububanzi / Isikhala | 0.05 / 0.05mm | 0.025 / 0.025mm |
Ukubekezelelana | Landela u-W / S | ± 0.03mm | ± 0.02mm |
(W/S≥0.3mm:±10%) | (W/S≥0.2mm:±10%) | ||
Imbobo ukuze imbobo | ± 0.075mm | ± 0.05mm | |
I-Hole Dimension | ± 0.075mm | ± 0.05mm | |
Impedance | 0 ≤ Inani ≤ 50Ω : ± 5Ω 50Ω ≤ Inani : ± 10%Ω | ||
Okubalulekile | Ukucaciswa kwe-Basefilm | PI: 3mil 2mil 1mil 0.8mil 0.5mil | |
I-ED&RA Cu : 2OZ 1OZ 1 / 2OZ 1 / 3OZ 1 / 4OZ | |||
I-Basefilm Umhlinzeki oyinhloko | Shengyi / Taiflex / Dupont / Doosan / Thinflex | ||
Ukucaciswa Kwekhava | PI: 2mil 1mil 0.5mil | ||
Umbala we-LPI | Okuluhlaza / Okuphuzi / Okumhlophe / Okumnyama / Okuluhlaza okwesibhakabhaka / Okubomvu | ||
I-PI Stiffener | T: 25um -250um | ||
I-FR4 Stiffener | T: 100um -2000um | ||
I-SUS Stiffener | T: 100um -400um | ||
AL Stiffener | T: 100um ~ 1600um | ||
Itheyiphu | 3M / Tesa / Nitto | ||
Ukuvikela i-EMI | Ifilimu yesiliva / Uyinki Wethusi / Wesiliva | ||
Ukuqedwa kobuso | OSP | 0.1 - 0.3um | |
I-HASL | Sn : 5um - 40um | ||
I-HASL (Leed free) | Sn : 5um - 40um | ||
ENEPIG | Inani: 1.0-6.0um | ||
Ibhethri: 0.015-0.10um | |||
Au : 0.015 - 0.10um | |||
Ukucwenga igolide eliqinile | Inani: 1.0-6.0um | ||
Au : 0.02um - 1um | |||
Igolide elikhanyayo | Inani: 1.0-6.0um | ||
Au : 0.02um - 0.1um | |||
ENIG | Inani: 1.0-6.0um | ||
Au : 0.015um - 0.10um | |||
Isiliva lokunamathisela | Isilinganiso: 0.1 - 0.3um | ||
I-Plating Tin | Sn : 5um - 35um | ||
I-SMT | Uhlobo | 0.3mm pitch Izixhumi | |
0.4mm iphimbo BGA / QFP / QFN | |||
Ingxenye ye-0201 |