| Izinto | Amandla |
| Ukubalwa kwesendlalelo | 1-40 ungqimba |
| Uhlobo lwama-laminates | FR-4(High Tg, Halogen Free, High Frequency) |
| FR-5, CEM-3, PTFE, BT, Getek, Aluminium base,Copper base,KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon |
| Ukujiya kwebhodi | 0.2mm-6mm |
| I-Max Base yethusi isisindo | 210um (6oz) wesendlalelo sangaphakathi esingu-210um (6oz) sesendlalelo sangaphandle |
| Usayizi omncane womshini wokubhola | 0.2mm (0.008") |
| Ukubukeka kwesilinganiso | 12:01 |
| Usayizi wephaneli omkhulu | Uhlangothi olulodwa noma izinhlangothi ezimbili: 500mm * 1200mm, |
| Izendlalelo Zezendlalelo Eziningi:508mm X 610mm (20" X 24") |
| Ububanzi/isikhala somugqa omncane | 0.076mm / 0.0.076mm (0.003" / 0.003") |
| Ngohlobo lwembobo | Impumputhe / Ingcwatshiwe / Ixhunyiwe(VOP,VIP…) |
| HDI / Microvia | YEBO |
| Ukuqedwa kobuso | I-HASL |
| Hola i-HASL yamahhala |
| Igolide lokucwiliswa (ENIG), ithini lokucwiliswa, isiliva lokucwiliswa |
| I-Organic Solderability Preservative (OSP) / ENTEK |
| I-Flash Gold(I-Hard Gold Plating) |
| ENEPIG |
| I-Selective Gold Plating, ukujiya kwegolide kufika ku-3um(120u") |
| Umunwe Wegolide, Ukuphrinta Kwekhabhoni, Oku peelable S/M |
| Umbala wemaski we-Solder | Okuluhlaza, Okuluhlaza okwesibhakabhaka, Okumhlophe, Okumnyama, Okucacile, njll. |
| Impedance | Ukulandelela okukodwa, okuhlukile, impedance ye-coplanar elawulwa ± 10% |
| Uhlobo lokuqeda uhlaka | Umzila we-CNC; I-V-Scoring / Cut; Punch |
| Ukubekezelelana | I-Min Hole tolerance (NPTH) | ±0.05mm |
| I-Min Hole tolerance (PTH) | ±0.075mm |
| Ukubekezelelana Kwephethini elincane | ±0.05mm |
