Umkhiqizi we-PCB Wokuncintisana

Iphrojekthi Okuqukethwe Amandla

1

ukuhlukaniswa kwebhodi I-Aluminium Base, I-Copper Base, isisekelo se-ceramics yethusi, Ibhodi Le-Bade Elihlanganisiwe

2

impahla I-Aluminium Yasekhaya.Ikhopha yasekhaya,I-aluminiyamu engenisiwe, ikhopha engenisiwe

3

ukwelashwa kwendawo I-HASL/ENIG/OSP/sikering

4

i-akhawunti yesendlalelo ibhodi eliphrintiwe elinohlangothi olulodwa/ibhodi eliphrintiwe elinamacala amabili

5

maxi.Usayizi Webhodi 1200mm*480m(n

6

min.Usayizi Webhodi 5mm*5mm

7

ububanzi bomugqa/apsce 0.1mnV0.1mm

8

i-wap and twist <=0.5%(tfiickness:1 .Omm,Usayizi Webhodi:300mm*300mm)

9

ukujiya kwebhodi 0.5mm-5.0mm

10

ukuqina kwe-copper foil 35urrV70um/105um/140um/175unV210um/245um/280um/315um/35Qjm

11

ukubekezelelana Umzila we-CNC: ±0.1 mm;punch: 士 0.1 mm

12

Ukubhaliswa kwe-V-CUT ± 0.1mm

13

Imbobo yodonga lwethusi ukujiya 20um-35um

14

Mm ukubhaliswa kwesikhundla somgodi (qhathanisa nedatha ye-CAD) ± 3mil( 10.076mm)

15

Imbobo encane yokubhoboza 1.0mm(Ukujiya kwebhodi bebw1.0mmr1.0mm)

16

Min.punching square slot (Ugqinsi lwebhodi lungaphansi kuka-1 .Omm, 1.0mm* 1 .Omm)

17

Ukubhaliswa kwesekethe ephrintiwe ± 0.076mm

18

Min.drill imbobo ububanzi 0.6mm

19

ukujiya kokwelashwa kwendawo plating igolide:Ni 4um-6um>Au0.1um-0.5umENIG:Ni 5um-6um,Au:0.0254um-0.127umisiliva: Ag3um-8umI-HASL: 40um-1 OOum

20

Ukubekezelelana kwe-V-CUTdegree (Iziqu)

21

Ubukhulu bebhodi le-V-CUT 0.6mm-4.0mm

22

Min.legend ububanzi 0.15mm

23

Min.Sldor mask ukuvulwa 0.35mm