Imikhiqizo Eyinhloko
I-PCB yensimbi
I-FPC
FR4+Ishumekiwe
PCBA
Indawo Yesicelo
Amacala Okufaka Isicelo Semikhiqizo Yenkampani
Isicelo ekukhanyeni kwe-NIO ES8
Isicelo ekukhanyeni kwe-ZEEKR 001
Imojula yokukhanya kwekhanda ye-matrix ye-ZEEKR 001 isebenzisa i-PCB ye-copper substrate enohlangothi olulodwa enobuchwepheshe be-thermal vias, ekhiqizwa inkampani yethu, efinyelelwa ngokubhoboza ama-vias ayimpumputhe alawula ukujula bese emboza ithusi ngembobo ukwenza ungqimba lwesekethe ephezulu kanye nephansi. yethusi substrate conductive, ngaleyo ndlela eqaphela conduction ukushisa. Ukusebenza kwayo kokunciphisa ukushisa kuphakeme kunokwebhodi elivamile elinohlangothi olulodwa, futhi ngesikhathi esifanayo ixazulula izinkinga zokukhipha ukushisa kwama-LED nama-IC, okuthuthukisa impilo yesevisi yesibani.
Isicelo ekukhanyeni kwe-ADB kwe-Aston Martin
I-aluminium substrate enezinhlangothi ezimbili enezingqimba ezimbili ekhiqizwe yinkampani yethu isetshenziswa ekukhanyeni kwe-ADB kwe-Aston Martin. Uma kuqhathaniswa nesibani sangaphambili esivamile, ukukhanya kwe-ADB kuhlakaniphe kakhulu, ngakho i-PCB inezingxenye eziningi kanye nezintambo eziyinkimbinkimbi. Isici senqubo yalesi substrate ukusebenzisa ungqimba oluphindwe kabili ukuxazulula inkinga yokukhishwa kokushisa kwezingxenye ngesikhathi esifanayo. Inkampani yethu isebenzisa isakhiwo se-heat-conductive enezinga lokukhipha ukushisa elingu-8W/MK ezingxenyeni ezimbili zokuvikela. Ukushisa okukhiqizwa yizingxenye kudluliselwa nge-vias eshisayo kuya kungqimba olukhipha ukushisa olukhipha ukushisa bese kuya phansi kwe-aluminium substrate.
Isicelo esiphakathi nendawo yeprojektha ye-AITO M9
I-PCB esetshenziswa enjinini yokukhanya emaphakathi esetshenziswa ku-AITO M9 ihlinzekwa yithi, okuhlanganisa ukukhiqizwa kwe-PCB engaphansi kwethusi kanye nokucutshungulwa kwe-SMT. Lo mkhiqizo usebenzisa i-substrate yethusi enobuchwepheshe bokuhlukanisa i-thermoelectric, futhi ukushisa komthombo wokukhanya kudluliselwa ngokuqondile ku-substrate. Ngaphezu kwalokho, sisebenzisa i-vacuum reflow soldering ye-SMT, evumela ukuthi izinga le-solder void lilawulwe ngaphakathi kuka-1%, ngaleyo ndlela kuxazululwe kangcono ukudluliswa kokushisa kwe-LED nokwandisa impilo yesevisi yawo wonke umthombo wokukhanya.
Isicelo kumalambu anamandla amakhulu
| Into yokukhiqiza | I-Thermoelectric separation yethusi substrate |
| Okubalulekile | I-Copper Substrate |
| Ungqimba Lwesekethe | 1-4L |
| Qeda ukujiya | 1-4mm |
| Circuit yethusi ukujiya | 1-4OZ |
| Landelela/isikhala | 0.1/0.075mm |
| Amandla | 100-5000W |
| Isicelo | I-Stagelamp, insiza yezithombe, amalambu enkundla |
Ikesi lesicelo le-Flex-Rigid(Metal).
Izicelo main kanye izinzuzo metal-based Flex-Rigid PCB
→ Isetshenziswa kumalambu ezimoto, ithoshi, i-optical projection...
→Ngaphandle kwehhanisi lezintambo kanye nokuxhumeka kwe-terminal, isakhiwo singenziwa lula futhi umthamo womzimba wesibani ungancishiswa
→Ukuxhumana phakathi kwe-PCB eguquguqukayo kanye ne-substrate kuyacindezelwa futhi kushiselwe, okunamandla kunokuxhumana kwetheminali
I-IGBT Normal Structure & IMS_Cu Structure
Izinzuzo ze-IMS_Cu Isakhiwo Ngaphezulu Kwephakheji Ye-DBC Ceramic:
➢ I-IMS_Cu PCB ingasetshenziselwa ukufaka izintambo endaweni enkulu ngokunganaki, yehlisa kakhulu inani lokuxhunywa kwezintambo ezibophezelayo.
➢ Iqede inqubo yokushisela i-DBC kanye ne-copper-substrate, kwehliswe izindleko zokushisela nokuhlanganisa.
➢ I-substrate ye-IMS ifaneleka kakhulu kumamojula wamandla okukhweza aphezulu ahlanganiswe phezulu
Umugqa wethusi oshiselwe ku-FR4 PCB evamile kanye ne-substrate yethusi eshumekiwe ngaphakathi kwe-FR4 PCB
Izinzuzo Ze-Substrate Yethusi Eshumekiwe Ngaphakathi Ngaphezu Kwemicu Yethusi Eshicilele Emkhathini:
➢ Ngokusebenzisa ubuchwepheshe bethusi obushumekiwe, inqubo yokushisela umugqa wethusi iyancishiswa, ukukhwezwa kube lula, nokusebenza kahle kuyathuthukiswa;
➢ Ngokusebenzisa ubuchwepheshe bethusi obushumekiwe, ukuchithwa kokushisa kwe-MOS kuxazululwa kangcono;
➢ Thuthukisa kakhulu umthamo wamanje wokugcwala, ungenza amandla aphezulu ngokwesibonelo u-1000A noma ngaphezulu.
Imigqa yethusi eshiselwe endaweni ye-aluminium substrate & nebhulokhi yethusi eshunyekiwe ngaphakathi kwe-substrate yethusi enohlangothi olulodwa
Izinzuzo Zebhulokhi Ye-Copper Eshumekiwe Ngaphakathi Ngaphezu Kwemicu Yethusi Eshiselwe Ngaphezulu(Okwe-PCB yensimbi):
➢ Ngokusebenzisa ubuchwepheshe bethusi obushumekiwe, inqubo yokushisela umugqa wethusi iyancishiswa, ukukhwezwa kube lula, nokusebenza kahle kuyathuthukiswa;
➢ Ngokusebenzisa ubuchwepheshe bethusi obushumekiwe, ukuchithwa kokushisa kwe-MOS kuxazululwa kangcono;
➢ Thuthukisa kakhulu umthamo wamanje wokugcwala, ungenza amandla aphezulu ngokwesibonelo u-1000A noma ngaphezulu.
I-substrate ye-ceramic eshumekiwe ngaphakathi kwe-FR4
Izinzuzo ze-Embedded Ceramic substrate:
➢ Ingafakwa ohlangothini olulodwa, izinhlangothi ezimbili, izendlalelo eziningi, futhi idrayivu ye-LED nama-chips kungahlanganiswa.
➢ Izitsha zobumba ze-Aluminium nitride zifanele ama-semiconductors ane-voltage ephakeme ukumelana nezidingo eziphakeme zokulahla ukushisa.
Xhumana nathi:
Engeza: 4th Floor, Building A, 2nd West side of Xizheng, Shajiao Community, Humeng Town Dongguan city
Ucingo: 0769-84581370
Email: cliff.jiang@dgkangna.com
http://www.dgkangna.com
