I-MCPCB isifinyezo se-Metal core PCBs, okuhlanganisa i-PCB esekwe ku-aluminium, i-PCB esekwe ethusi kanye ne-PCB esekwe ngensimbi.
Ibhodi elisekelwe ku-aluminium liwuhlobo oluvame kakhulu.Isisekelo sezinto siqukethe i-aluminium core, i-FR4 ejwayelekile nethusi.Ifaka isendlalelo esigqoke esishisayo esichitha ukushisa ngendlela esebenza kahle kakhulu ngenkathi kupholisa izingxenye .Njengamanje, i-Aluminium Based PCB ithathwa njengesixazululo samandla aphezulu.Ibhodi elisekelwe ku-aluminium lingangena esikhundleni sebhodi le-ceramic elithambile, futhi i-aluminium inikeza amandla nokuqina kumkhiqizo izisekelo ze-ceramic ezingakwazi.
I-Copper substrate ingenye yezingxenye zensimbi ezibiza kakhulu, futhi ukuhamba kwayo okushisayo kungcono izikhathi eziningi kune-aluminium substrates kanye ne-iron substrates.Ifaneleka kahle kakhulu ekulahlekeni kokushisa kwamasekhethi aphezulu, izingxenye ezisezifundeni ezinokuhlukahluka okukhulu kwezinga lokushisa eliphezulu neliphansi kanye nemishini yokuxhumana enembile.
Isendlalelo se-thermal insulation singenye yezingxenye eziyinhloko ze-copper substrate, ngakho-ke ubukhulu be-copper foil ngokuvamile bungama-35 m-280 m, okungafinyelela umthamo oqinile wokuthwala okwamanje.Uma kuqhathaniswa ne-aluminium substrate, i-copper substrate ingafinyelela umphumela ongcono wokulahla ukushisa, ukuze kuqinisekiswe ukuzinza komkhiqizo.
Isakhiwo se-Aluminium PCB
Circuit Copper Layer
Isendlalelo sethusi sesifunda siyathuthukiswa futhi siqoshwe ukuze sakhe isifunda esiphrintiwe, i-aluminium substrate ingathwala amandla amanje aphezulu kunokuqina okufanayo kwe-FR-4 kanye nobubanzi bokulandelela okufanayo.
I-Insulating Layer
Isendlalelo se-insulating ubuchwepheshe obuyinhloko be-aluminium substrate, edlala ngokuyinhloko imisebenzi yokufakelwa nokushisa.I-aluminium substrate insulating layer iyisithiyo esikhulu sokushisa esakhiweni semojula yamandla.Ukushisa okungcono kwe-thermal layer ye-insulating, kuphumelela kakhulu ukusabalalisa ukushisa okukhiqizwa ngesikhathi sokusebenza kwedivayisi, kanye nokunciphisa izinga lokushisa kwedivayisi,
I-Metal substrate
Iluphi uhlobo lwensimbi esizolukhetha njenge-substrate yensimbi evikelayo?
Kudingeka sicabangele i-coefficient yokwandisa okushisayo, ukuqhutshwa kwe-thermal, amandla, ubulukhuni, isisindo, isimo esiphezulu kanye nezindleko ze-substrate yensimbi.
Ngokuvamile, i-aluminium ishibhile kakhulu kunethusi.Izinto ezitholakalayo ze-aluminium ziyi-6061, 5052, 1060 nokunye.Uma kunezidingo eziphakeme ze-thermal conductivity, izakhiwo zemishini, izakhiwo zikagesi nezinye izinto ezikhethekile, amapuleti ethusi, amapuleti ensimbi engagqwali, amapuleti ensimbi namapuleti ensimbi ye-silicon angasetshenziswa.
Isicelo seI-MCPCB
1. Umsindo : Okokufaka, isikhulisi sesandisi esiphumayo, isikhulisi sesandisi esilinganiselwe, isikhulisi somsindo, isikhulisi samandla.
2. Ukunikezwa kwamandla: Isilawuli sokushintsha, isiguquli se-DC / AC, isilawuli se-SW, njll.
3. Imoto: Isilawuli se-elekthronikhi, okokuthungela, isilawuli sokuphakelwa kwamandla, njll.
4. Ikhompyutha: Ibhodi le-CPU, i-floppy disk drive, amadivaysi okuphakela amandla, njll.
5. Amamojula Amandla: I-Inverter, ama-solid-state relays, amabhuloho okulungisa.
6. Amalambu nokukhanyisa: amalambu okonga amandla, amalambu e-LED anemibala ehlukahlukene, ukukhanya kwangaphandle, ukukhanya kwasesiteji, ukukhanya komthombo
Uhlobo lwensimbi: Isisekelo se-Aluminium
Inombolo yezendlalelo:1
Ubuso:Ukuhola i-HASL yamahhala
Ubukhulu bepuleti:1.5mm
Ugqinsi lwethusi:35 um
I-Thermal Conductivity:8w/mk
Ukumelana nokushisa:0.015℃/W
Uhlobo lwensimbi: Aluminiumisisekelo
Inombolo yezendlalelo:2
Ubuso:OSP
Ubukhulu bepuleti:1.5mm
Ubukhulu bethusi: 35um
Uhlobo lwenqubo:I-Thermoelectric separation yethusi substrate
I-Thermal Conductivity:398W/mk
Ukumelana nokushisa:0.015℃/W
Umqondo wokuklama:Umhlahlandlela wensimbi oqondile, indawo yokuxhumana yebhulokhi yethusi inkulu, futhi izintambo zincane.
Gxila ekunikezeni izixazululo ze-mong pu iminyaka emi-5.